Sapphire Wafer

Atecom professionally provides 2", 4" and 6 " C-plane, R-plane, A-plane and M-plane epi-ready sapphire wafers. Single-side or double-side epi-ready polishing, standard thickness at 1000um, 650um and 430um, ultra-thin wafers are available, and other specific specifications can provide upon your request.


 

Parameter Spec Unit
Product Name Sapphire Wafer (Al2O3)  
Diameter 2” 4” 6” mm
Thickness  430± 20 650± 25 1000± 30 μm
Surface Orientation C-Plane (0001) tilted M-axis 0.2°± 0.1° degree
Primary Flat             A-Axis (11-20) ± 0.2° degree
Orientation Length 16 ± 0.5 31 ± 1.0 57.5 ± 2.5 mm
TTV ≦ 10 ≦ 20 ≦ 20 μm
Bow 0~-10 0~-20 0~-20 μm
Warp ≦ 15 ≦ 40 ≦ 50 μm
Roughness Front Side  ≦ 10 ≦ 10 ≦ 15 Å
Roughness Back Side 0.6 ≦ Ra ≦ 1.2 μm
Wafer Edge  R-Type or F-Type  
Laser Mark Customize