Glass wafer/Quartz for Semiconductor, VR, Projector, Laser TV, Optical communication, Medical application.
Spec
Unit
Glass wafer
Material
Af32/ BF33/ D263Teco/ H-K509 / H-ZF3/ JGS1 and others
Diameter
mm
Φ150±0.1
Φ200±0.1
Φ300±0.1
Thickness
0.11~1.1
Warp
um
≤20
≤30
≤35
Surface
10/15 (MIL-PRF-13830B)