AlN Wafer
AlN wafer have the characteristics of high thermal conductivity, high heat dissipation, and high insulation, and their thermal expansion coefficient is close to that of silicon wafers.
It has small dielectric constant and high mechanical strength and density at the same time, and hs good corrosion resistance to molten metal.
Application: Heat dissipation substrate, LED package, power module, wafer bonding, power resistor.
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Item / unit |
AlN Wafer |
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Thickness (µm) |
100 ~ 2000 |
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Size (inch) |
6’/8”/12” |
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Color |
Beige - Gray |
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Shape |
Rotundity |
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Through hole (mm) |
≧φ0.1 |
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Bulk density (g/cm3) |
3.4 |
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Surface roughness (µm) |
<0.8 |
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Thermal Characteristic |
Thermal conductivity |
25℃ |
W/(mK) |
180 |
200 |
230 |
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Coefficient of |
40-400℃ |
×10-6/K |
4.8 |
4.8 |
4.8 |
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Thermal expansion |
40-800℃ |
×10-6/K |
5.4 |
5.4 |
5.4 |
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