Sapphire Wafer
Atecom professionally provides 2", 4" and 6 " C-plane, R-plane, A-plane and M-plane epi-ready sapphire wafers. Single-side or double-side epi-ready polishing, standard thickness at 1000um, 650um and 430um, ultra-thin wafers are available, and other specific specifications can provide upon your request.
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Product Name
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Sapphire Wafer (Al2O3)
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Diameter
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50.8
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100
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150
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mm
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Thickness*
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430± 15
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650± 15
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1300± 25
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μm
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Surface Orientation*
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C-Plane (0001) tilted M-axis 0.2°± 0.1°
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degree
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Primary Flat
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A-Axis (11-20) ± 0.2°
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degree
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Orientation Length
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16 ± 0.5
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30 ± 1.0
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49.0 ± 1..0
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mm
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TTV
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≤ 5
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≤ 10
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≤ 15
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μm
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Bow
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0~-10
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0~-10
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0~-20
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μm
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Warp
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≤ 10
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≤ 15
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≤ 30
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μm
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Roughness
Front Side
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≤ 0.2
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≤ 0.2
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≤ 0.2
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nm
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Roughness
Back Side
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0.8 ≦ Ra ≦ 1.2
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μm
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Wafer Edge*
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R-Type / T-Type
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Laser Mark*
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On Front Side Near Primary Flat
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* Other surface conditions & customized specifications are welcome
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