Silicon wafer is the most common material and widely used for a variety of high-tech industries, including integrated circuits , detector or sensor device , MEMS fabrication, opto-electronic components, and solar cells .
Float Zone FZ-Silicon Specification |
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Parameter |
Conduction Type |
Orientation |
Diameter(mm) |
Resistivity(Ω.cm) |
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High Resistivity |
N&P |
<100>&<111> |
76.2-200 |
>1000 |
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Neutron Radiation |
N&P |
<100>&<111> |
76.2-200 |
30-800 |
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CFZ |
N&P |
<100>&<111> |
76.2-200 |
1-50 |
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Meteorological Adulteration |
N&P |
<100>&<111> |
76.2-200 |
0.01-300 |
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Czochralski CZ-Silicon Specification |
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Parameter |
Conduction Type |
Orientation |
Diameter(mm) |
Resistivity(Ω.cm) |
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CZ |
N&P |
<100><110><111> |
76.2-300 |
1-100 |
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MCZ |
N&P |
76.2-300 |
1-100 |
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Heavy Dopant |
N&P |
<100>&<111> |
76.2-300 |
0.001-1 |
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Polished Wafer Specification |
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Parameter |
Unit |
FZ |
CZ |
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heavily doped |
lightly doped |
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Available Spec |
Available Spec |
Available Spec |
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Diameter |
mm |
200 |
200 |
300 |
200 |
300 |
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Thickness |
um |
400-1000 |
400-1000 |
775±20 |
400-1000 |
775±20 |
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TTV |
um |
<3~5 |
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TIR |
um |
<3~5 |
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BOW |
um |
<20~40 |
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WARP |
um |
<20~40 |